GENERAL PURPOSE OF THE CONFERENCE

The aim of ESSDERC and ESSCIRC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. The level of integration for system-on- chip design is rapidly increasing. This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers and system designers is necessary.

While keeping separate Technical Program Committees, ESSDERC and ESSCIRC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both communities. Attendees registered for either conference are encouraged to attend any of the scheduled parallel sessions, regardless to which conference they belong. ​

CONFERENCE HIGHLIGHTS

• 4 joint keynote presentations
• 3 ESSDERC keynote presentations
• 3 ESSCIRC keynote presentations
• Invited papers with overall coverage of all aspects of advanced devices and circuits
• Presentation of IEEE and
• ESSDERC/ESSCIRC Awards ESSDERC/ESSCIRC Welcome Reception on Tuesday, September 20, 2022
• ESSDERC/ESSCIRC Gala Dinner on Wednesday, September 21, 2022
• Tutorials and workshops

The venue of the conference events, including workshops and tutorials, will be at the University of Milan-Bicocca (Milan, IT), that is well connected (metro, bus, train with Milan downtown). The working language of the conference is English. ​ ​

BEST PAPER AWARDS

Papers presented at the conference will be considered for the ”Best Paper Award” and ”Best Young Scientist Paper Award”. The selection will be based on the results of the paper selection process and the judgment of the conference participants. The 2022 Award Ceremony will take place during ESSDERC/ESSCIRC 2023. ​

CONFERENCE TARGET AND EVOLUTION

ESSDERC and ESSCIRC have evolved over the last years to follow recent R&D device, circuit and system fast-growing topics. Besides the traditional ESSDERC and ESSCIRC tracks, a number of JOINT tracks have been introduced, to encourage and facilitate interactions between circuit, system and device researchers.

ESSDERC/ESSCIRC encourages submissions in all areas of solid-state devices, circuits and systems, with special emphasis on:

• Analog, Power and RF Devices
• Electron Device Simulation and Modeling
• Advanced Technology, Processes and Materials
• Neuromorphic Computing, Advanced Memories, Al Accelerators, in-Memory-Computing, Security
• Advanced Computing Devices and Circuits: Advanced CMOS, Post-CMOS, Quantum Computing
• Sensors, MEMS, Bioelectronics, Biomedical Electronics, Optoelectronics, Display and Imaging
• Analog Circuits
• Data Converters
• RF and mm-Wave Circuits
• Frequency Generation
• Wireless and Wireline Interfaces
• Integrated Power Electronics and Power Management
• Digital Circuits & Systems

Student papers are welcome and encouraged. ​

PAPERS SUBMISSION

Papers submitted for review must clearly state:

• The purpose of the work
• How and to what extent it advances the state-of-the art
• Specific results and their impact

Only material that has not been previously published or submitted elsewhere will be considered. Submission of a paper for review and subsequent acceptance is considered as a commitment that the work will not be publicly available prior to the conference.

Manuscript guidelines, as well as instructions on how to electronically submit papers will be available in the 1st Call for Papers and on this website.

Papers must not exceed four A4 pages with all illustrations and references included.

Papers submission deadline: April, 12, 2022 ​

Download First Announcement

PAST EDITIONS

• 2017 Leuven
• 2018 Dresden
• 2019 Cracow
• 2020 Grenoble (Virtual Educational Events)
• 2021 Grenoble (Virtual Conference and Virtual Educatinal Events)