The EAI Presentation Video
EAI Conference Documents
European Embedded AI Ecosystem
Frank Badstübner (Infineon Technologies AG, DE), Björn Debaillie (imec, BE), Mario Diaz Nava (STMicroelectronics, FR), Ovidiu Vermesan (SINTEF, NO) - Large-scale projects overview: ECSEL JU AI4DI, TEMPO, ANDANT
Session: Embedded AI devices and systems (Moderator: Björn Debaillie, imec, BE)
Sourav De (Fraunhofer IPMS, DE) - Low-Power Vertically Stacked One Time Programmable Multi-bit IGZO-Based BEOL Compatible Ferroelectric TFT Memory Devices with Lifelong Retention for Monolithic 3D-Inference Engine Applications
Session: Embedded AI solutions (Moderator: Frank Badstübner Infineon Technologies, DE)
Bernhard Lippmann (Infineon Technologies, DE) - Addressing Physical and Functional Reverse Engineering Challenges for Advanced IoT Solutions with AI
September 19 / 2022, Milan, Italy
The International Workshop on Embedded Artificial Intelligence (EAI) - Devices, Systems, and Industrial Applications is part of the ESSCIRC ESSDERC 2022 European Solid-state Circuits and Devices Conference held in Milan, Italy, on 19 September 2022. Recent technological developments in sensors, edge computing, connectivity, and artificial intelligence (AI) technologies have accelerated the integration of data analysis based on embedded AI capabilities into resource-constrained, energy efficient hardware devices for processing information at the network edge.
New sensors, scalability, low power consumption, efficient connectivity and low latency in the edge infrastructure drive the expansion of the micro-, deep-, and meta-edge continuum and distributed AI-based computing architectures to support smarter applications. Hardware, software, algorithms, frameworks, and toolchains are essential for unlocking edge AI technologies? potential for various applications in several industrial sectors.
New edge processing circuits and devices are emerging, including CPUs, GPUs, TPUs, ASICs, FPGAs, SoC accelerators with novel neuromorphic processing architectures. This workshop combines academics, researchers, and industry practitioners from various fields, including AI, cyber-physical, and embedded systems, microelectronics circuits and devices, edge computing, and autonomous integrated systems. Different views on current and future embedded AI are discussed, and the latest developments in devices, techniques, and industrial-edge applications are presented.
The workshop also includes invited keynote talks and presentations with audience opportunities to interact with the speakers, discuss novel and exciting research, and establish new and fruitful collaborations in the embedded AI field. The EAI workshop is co-organised by three large-scale ECSEL JU projects, AI4DI, ANDANTE, and TEMPO, to provide a platform to exchange knowledge and ideas among experts and professionals interested in advances in AI circuits and device design, AI hardware architectures, industrial edge AI technologies, toolchains and applications.
You will find more information on the official Conference Website